OUR EQUIPMENT
WIRE BONDING
Microscopic Connectivity
Our TPT HB16 thermosonic wire bonder is able to bond various wire types to a wide range of substrates, from Au, Al, Cu, and Ag.
DIE BONDING
Precision Alignment
Using the HB70 or HB80 we can precisely align and bond a wide variety of dies from passive waveguides to electro-optic devices.
FIBER SPLICING
Expert Service
The Fujikura FSM-100P can precisely align and fuse a wide variety of fiber types from 405nm PM to Large Core Multimode fiber.
GLASS PROCESSING
Fiber Shaping
Vytran's GPX 3850 is the top of the line instrument for creating unparalleled fiber features. With this instrument we can create end-capped fibers, ball lensed fibers, tapered fibers, and much more.
OUR EFFORTS
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Chi3 Optics offers a wide variety of services ranging from CAD design to optical layout. We take pride in our ability to provide the customer with a well engineered system on time and within budget.